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II
117TH CONGRESS
1ST SESSION
S. 1419
To require the Secretary of Defense to support and provide incentives for
domestic manufacturing of printed circuit boards, to identify national
security risks in printed circuit boards imported from certain foreign
countries, and for other purposes.
IN THE SENATE OF THE UNITED STATES
APRIL 28, 2021
Mr. HAWLEY introduced the following bill; which was read twice and referred
to the Committee on Armed Services
A BILL
To require the Secretary of Defense to support and provide
incentives for domestic manufacturing of printed circuit
boards, to identify national security risks in printed cir-
cuit boards imported from certain foreign countries, and
for other purposes.
Be it enacted by the Senate and House of Representa-
1
tives of the United States of America in Congress assembled,
2
SECTION 1. SHORT TITLE.
3
This Act may be cited as the ‘‘Protecting Critical
4
Boards and Electronics Through Transparency and En-
5
during Reinvestment Act of 2021’’ or the ‘‘PCBETTER
6
Act of 2021’’.
7
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•S 1419 IS
SEC. 2. ESTABLISHMENT OF ELECTRONICS SUPPLY CHAIN
1
FUND AND ASSISTANCE AND INCENTIVES
2
FOR DOMESTIC MANUFACTURING OF PRINT-
3
ED CIRCUIT BOARDS.
4
(a) ESTABLISHMENT
OF
ELECTRONICS
SUPPLY
5
CHAIN FUND.—There is established in the Treasury of
6
the United States a trust fund to be known as the ‘‘Elec-
7
tronics Supply Chain Fund’’ (in this section the ‘‘Fund’’).
8
(b) CONTENTS OF FUND.—
9
(1) IN GENERAL.—The Fund shall consists of
10
such amounts as may be appropriated for deposit in
11
the Fund.
12
(2) AVAILABILITY.—
13
(A) IN GENERAL.—Amounts deposited in
14
the Fund shall remain available through the
15
end of the tenth fiscal year beginning after the
16
date on which funds are first appropriated to
17
the Fund.
18
(B)
REMAINDER
TO
TREASURY.—Any
19
amounts remaining in the Fund after the date
20
specified in subparagraph (A) shall be deposited
21
in the general fund of the Treasury.
22
(c) USE OF FUND.—Amounts deposited in the Fund
23
shall be available to the Secretary of Defense—
24
(1) to fund the construction, expansion, or mod-
25
ernization of facilities to develop or manufacture
26
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•S 1419 IS
semiconductors, microelectronics, advanced elec-
1
tronic packaging, and printed circuit boards;
2
(2) to carry out subsection (d); and
3
(3) to carry out section 4(a).
4
(d)
SPECIFIC
ACTIVITIES
REQUIRED.—Using
5
amounts from the Fund, the Secretary of Defense, in con-
6
sultation with the Secretary of Commerce, the Secretary
7
of Homeland Security, the Director of National Intel-
8
ligence, and such other officials as the Secretary of De-
9
fense considers appropriate, shall—
10
(1) promote and deploy technology, including
11
microelectronics, printed circuit boards, semiconduc-
12
tors, and related technologies so as to create a com-
13
mercially competitive electronics industry in the
14
United States capable of meeting United States na-
15
tional security needs;
16
(2) establish production and manufacturing
17
sites for the technologies described in paragraph (1);
18
and
19
(3) establish security standards necessary for
20
the implementation of—
21
(A) this Act;
22
(B) section 889 of the John S. McCain
23
National Defense Authorization Act for Fiscal
24
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•S 1419 IS
Year 2019 (Public Law 115–232; 132 Stat.
1
1917);
2
(C) section 224 of the National Defense
3
Authorization Act for Fiscal Year 2020 (Public
4
Law 116–92; 10 U.S.C. 2302 note); and
5
(D) section 841 of the William M. (Mac)
6
Thornberry National Defense Authorization Act
7
for Fiscal Year 2021 (Public Law 116–283).
8
(e) PRINTED CIRCUIT BOARD MANUFACTURING AS
9
QUALIFYING CAPABILITY.—The Secretary of Defense
10
shall consider printed circuit board manufacturing as a
11
qualifying capability when making funds available for the
12
construction, expansion, or modernization of domestic de-
13
velopment or manufacturing capabilities for semiconduc-
14
tors or electronic packaging.
15
SEC. 3. REQUIREMENT THAT CERTAIN PROVIDERS OF SYS-
16
TEMS TO DEPARTMENT OF DEFENSE DIS-
17
CLOSE THE SOURCE OF PRINTED CIRCUIT
18
BOARDS WHEN SOURCED FROM CERTAIN
19
COUNTRIES.
20
(a) DISCLOSURE.—The Secretary of Defense shall re-
21
quire any provider of a covered system to provide to the
22
Department of Defense, along with delivery of the covered
23
system, a list of the printed circuit boards in the covered
24
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•S 1419 IS
system that includes, for each printed circuit board, an
1
attestation of whether—
2
(1) the printed circuit board was partially or
3
fully manufactured and assembled in a covered na-
4
tion;
5
(2) the printed circuit board was fully manufac-
6
tured and assembled outside of a covered nation; or
7
(3) the provider cannot determine where the
8
printed circuit board was manufactured and assem-
9
bled.
10
(b) REGULATIONS.—Not later than 90 days after the
11
date of the enactment of this Act, the Secretary shall pro-
12
mulgate such regulations as are necessary to carry out this
13
section.
14
(c) DEFINITIONS.—In this section:
15
(1) The term ‘‘covered nation’’ includes the fol-
16
lowing:
17
(A) The People’s Republic of China.
18
(B) The Russian Federation.
19
(C) The Democratic People’s Republic of
20
North Korea.
21
(D) The Islamic Republic of Iran.
22
(2) The term ‘‘covered system’’ means any
23
item, including commercial items and commercially
24
available off-the-shelf items, notwithstanding section
25
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•S 1419 IS
3452 of title 10, United States Code, as redesig-
1
nated by section 1821(a)(1) of the William M. (Mac)
2
Thornberry National Defense Authorization Act for
3
Fiscal Year 2021 (Public Law 116–283), or sections
4
1906 and 1907 of title 41, United States Code,
5
that—
6
(A) has an electronic component;
7
(B) is provided to the Department of De-
8
fense under a contract that exceeds the sim-
9
plified acquisition threshold; and
10
(C) transmits or stores information includ-
11
ing—
12
(i) telecommunications;
13
(ii) data communications and storage,
14
including servers, switches, and networking
15
systems, but excluding personal data stor-
16
age devices, personal computers, desktop
17
computers, tablets, and handheld equip-
18
ment;
19
(iii) information technology security
20
systems; and
21
(iv) any other system that the Sec-
22
retary determines should be covered.
23
(3) The term ‘‘manufactured and assembled’’,
24
with respect to a printed circuit board, includes all
25
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•S 1419 IS
actions from the printing of the printed circuit board
1
from raw materials to the integration of the com-
2
pleted printed circuit board in an end item or com-
3
ponent of an end item.
4
SEC. 4. DEPARTMENT OF DEFENSE TESTING OF VULNER-
5
ABILITY OF SYSTEMS WITH PRINTED CIRCUIT
6
BOARDS FROM CERTAIN COUNTRIES AND RE-
7
MEDIATION
AND
PREVENTION
OF
SUCH
8
VULNERABILITIES.
9
(a) TESTING.—
10
(1) PROGRAM
ESTABLISHMENT
REQUIRED.—
11
Not later than one year after the date of the enact-
12
ment of this Act, the Secretary of Defense shall es-
13
tablish a program to test systems owned or operated
14
by the Department of Defense for vulnerabilities to
15
foreign interference, sabotage, espionage, and attack.
16
(2) REQUIRED
TESTING
FOR
CERTAIN
SYS-
17
TEMS.—Through the program established under
18
paragraph (1), the Secretary shall test each system
19
of the Department that contains at least one printed
20
circuit board for which a disclosure was made pursu-
21
ant to section 3(a) and an attestation was made
22
with respect to paragraph (1) or (3) of such section.
23
(3) METHODS.—The Secretary shall ensure
24
that the program established under paragraph (1)
25
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•S 1419 IS
uses, to the maximum extent practicable, best-in-
1
breed testing and detection methods used by com-
2
mercial industry, including—
3
(A) penetration testing;
4
(B) red teaming; and
5
(C) inventory auditing.
6
(b) REMEDIATION.—
7
(1) DESIGNATION.—Whenever informed of a
8
vulnerability in a system under the program estab-
9
lished under subsection (a)(1), the Secretary shall
10
designate a senior official of the Department to re-
11
mediate the vulnerability as soon as practicable.
12
(2) REQUIREMENTS.—Remediation under para-
13
graph (1) shall include those measures that the des-
14
ignated official determines necessary to lower the
15
risk to acceptable levels, including—
16
(A) adding hardware or software to isolate
17
and contain any malicious printed circuit board;
18
(B) destruction, deactivation, or replace-
19
ment of the system containing the vulnerability;
20
or
21
(C) physical modification of the system
22
containing the vulnerability through the inser-
23
tion of a trusted printed circuit board or other
24
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•S 1419 IS
hardware
that
does
not
contain
known
1
vulnerabilities.
2
(3) ASSIGNMENT OF COSTS.—
3
(A) DETERMINATION.—Whenever a vul-
4
nerability is found in a system from a con-
5
tractor through the program established under
6
subsection (a)(1), the Secretary of Defense
7
shall determine whether the contractor should
8
reasonably have discovered the vulnerability
9
prior to delivery of the system to the Depart-
10
ment.
11
(B) PAYMENT BY CONTRACTOR.—If, pur-
12
suant to subparagraph (A), the Secretary deter-
13
mines that a contractor should reasonably have
14
discovered the vulnerability prior to delivery to
15
the Department, the Secretary may withhold
16
future payments to the contractor in an amount
17
not to exceed the amount expended by the De-
18
partment on remediation of the affected system.
19
(C) PRESUMPTION.—
20
(i) IN GENERAL.—If the Secretary de-
21
termines that a vulnerability identified
22
through the program established under
23
subsection (a)(1) is the result of any print-
24
ed circuit board that the contractor im-
25
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•S 1419 IS
ported from the People’s Republic of China
1
after December 31, 2021, the Secretary
2
shall presume that the contractor reason-
3
ably should have discovered the vulner-
4
ability prior to delivery to the Department.
5
(ii) REBUTTAL ALLOWED.—The con-
6
tractor may rebut a presumption under
7
clause (i) with a showing of technical im-
8
possibility.
9
(c) PREVENTION.—Not later than one year after the
10
date of the enactment of this Act, the Secretary shall pro-
11
mulgate such regulations as the Secretary considers nec-
12
essary to require contractors selling goods or services to
13
the Department that include printed circuit boards to un-
14
dertake such due diligence as the Secretary considers ap-
15
propriate to prevent the occurrence of vulnerabilities in
16
such goods and services, including—
17
(1) certification of the ownership, management,
18
and security of subcontractors;
19
(2) conducting penetration testing, red teaming
20
exercises, and other simulated attacks against the
21
good or service; and
22
(3) compliance with the Cybersecurity Maturity
23
Model Certification, or successor model certification.
24
(d) ANNUAL REPORTS.—
25
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•S 1419 IS
(1) IN GENERAL.—Not later than December 31
1
of each year, the Secretary of Defense shall submit
2
to the congressional defense committees a report on
3
the activities carried out under this section during
4
the preceding fiscal year.
5
(2) CONTENTS.—Each report submitted under
6
paragraph (1) shall include, for the period covered
7
by the report, the following:
8
(A) The number of systems tested for
9
vulnerabilities.
10
(B) The number of systems identified as
11
having a vulnerability.
12
(C) The number of systems that the De-
13
partment has yet to test under this section.
14
(D) The identity of any contractors that
15
have been identified as failing to reasonably dis-
16
cover a vulnerability in a good or service pro-
17
vided to the Department of Defense.
18
(E) Such other information as the Sec-
19
retary considers appropriate.
20
(e) CONGRESSIONAL DEFENSE COMMITTEES DE-
21
FINED.—In this section, the term ‘‘congressional defense
22
committees’’ has the meaning given that term in section
23
101(a) of title 10, United States Code.
24
Æ
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