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II
117TH CONGRESS
1ST SESSION
S. 2107
To amend the Internal Revenue Code of 1986 to establish the semiconductor
manufacturing investment credit.
IN THE SENATE OF THE UNITED STATES
JUNE 17, 2021
Mr. WYDEN (for himself, Mr. CRAPO, Mr. WARNER, Mr. CORNYN, Ms. STABE-
NOW, and Mr. DAINES) introduced the following bill; which was read
twice and referred to the Committee on Finance
A BILL
To amend the Internal Revenue Code of 1986 to establish
the semiconductor manufacturing investment credit.
Be it enacted by the Senate and House of Representa-
1
tives of the United States of America in Congress assembled,
2
SECTION 1. SHORT TITLE.
3
This Act may be cited as the ‘‘Facilitating American-
4
Built Semiconductors Act’’ or the ‘‘FABS Act’’.
5
SEC. 2. SEMICONDUCTOR MANUFACTURING INVESTMENT
6
CREDIT.
7
(a) IN GENERAL.—Subpart E of part IV of sub-
8
chapter A of chapter 1 of the Internal Revenue Code of
9
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•S 2107 IS
1986 is amended by inserting after section 48C the fol-
1
lowing new section:
2
‘‘SEC. 48D. SEMICONDUCTOR MANUFACTURING INVEST-
3
MENT CREDIT.
4
‘‘(a) IN GENERAL.—For purposes of section 46, the
5
semiconductor manufacturing investment credit for any
6
taxable year is an amount equal to the sum of—
7
‘‘(1) 25 percent of the qualified investment for
8
such taxable year with respect to any semiconductor
9
manufacturing facility, and
10
‘‘(2) 25 percent of the qualified investment for
11
such taxable year with respect to any semiconductor
12
manufacturing property.
13
‘‘(b) QUALIFIED INVESTMENT WITH RESPECT TO
14
SEMICONDUCTOR MANUFACTURING FACILITIES.—
15
‘‘(1) IN GENERAL.—For purposes of subsection
16
(a)(1), the qualified investment with respect to any
17
semiconductor manufacturing facility for any taxable
18
year is the basis of any qualified property placed in
19
service by the taxpayer during such taxable year
20
which is part of a semiconductor manufacturing fa-
21
cility.
22
‘‘(2) QUALIFIED PROPERTY.—For purposes of
23
this subsection, the term ‘qualified property’ means
24
property—
25
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‘‘(A) which is tangible property (including
1
a building or its structural components) which
2
is an integral part of a semiconductor manufac-
3
turing facility,
4
‘‘(B) with respect to which depreciation (or
5
amortization in lieu of depreciation) is allow-
6
able,
7
‘‘(C) which is—
8
‘‘(i) constructed, reconstructed, or
9
erected by the taxpayer, or
10
‘‘(ii) acquired by the taxpayer if the
11
original use of such property commences
12
with the taxpayer, and
13
‘‘(D) which is necessary for the manufac-
14
turing or processing of, or performing research
15
with respect to, semiconductors or semicon-
16
ductor tooling equipment.
17
‘‘(3) SEMICONDUCTOR MANUFACTURING FACIL-
18
ITY.—For purposes of this subpart, the term ‘semi-
19
conductor manufacturing facility’ means a facility
20
for which the primary purpose is the manufacturing
21
or processing of, or performing research with respect
22
to, semiconductors or semiconductor tooling equip-
23
ment.
24
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‘‘(4) COORDINATION
WITH
REHABILITATION
1
CREDIT
AND
SEMICONDUCTOR
MANUFACTURING
2
PROPERTY.—The qualified investment with respect
3
to any semiconductor manufacturing facility for any
4
taxable year shall not include that portion of the
5
basis of any property which is—
6
‘‘(A) attributable to qualified rehabilitation
7
expenditures (as defined in section 47(c)(2)), or
8
‘‘(B) semiconductor manufacturing prop-
9
erty (as defined in subsection (c)(2)).
10
‘‘(c) QUALIFIED INVESTMENT WITH RESPECT TO
11
SEMICONDUCTOR MANUFACTURING PROPERTY.—
12
‘‘(1) IN GENERAL.—For purposes of subsection
13
(a)(2), the qualified investment with respect to semi-
14
conductor manufacturing property for any taxable
15
year is the basis of any semiconductor manufac-
16
turing property placed in service by the taxpayer
17
during such taxable year.
18
‘‘(2) SEMICONDUCTOR MANUFACTURING PROP-
19
ERTY.—For purposes of this subpart, the term
20
‘semiconductor manufacturing property’ means tan-
21
gible property—
22
‘‘(A) for which the primary purpose is to
23
manufacture or process, or perform research
24
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with respect to, semiconductors or semicon-
1
ductor tooling equipment,
2
‘‘(B) with respect to which depreciation (or
3
amortization in lieu of depreciation) is allow-
4
able, and
5
‘‘(C) which is—
6
‘‘(i) constructed, reconstructed, or
7
erected by the taxpayer, or
8
‘‘(ii) acquired by the taxpayer if the
9
original use of such property commences
10
with the taxpayer.
11
‘‘(d) CERTAIN
PROGRESS
EXPENDITURE
RULES
12
MADE APPLICABLE.—Rules similar to the rules of sub-
13
sections (c)(4) and (d) of section 46 (as in effect on the
14
day before the date of the enactment of the Revenue Rec-
15
onciliation Act of 1990) shall apply for purposes of sub-
16
section (a).
17
‘‘(e) REGULATIONS AND GUIDANCE.—The Secretary
18
shall prescribe such regulations or other guidance as may
19
be necessary or appropriate to carry out the purposes of
20
this section, including regulations or other guidance with
21
respect to—
22
‘‘(1) determining the basis of qualified property
23
and semiconductor manufacturing property,
24
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‘‘(2) any such measures as are deemed appro-
1
priate to avoid abuse or fraud with respect to the
2
credit allowed under this section, and
3
‘‘(3) ensuring that such credit is not allowed to
4
multiple taxpayers.’’.
5
(b) ELECTION FOR DIRECT PAYMENT.—Section 48D
6
of the Internal Revenue Code of 1986, as added by sub-
7
section (a), is amended by adding at the end the following:
8
‘‘(f) ELECTION FOR DIRECT PAYMENT.—
9
‘‘(1) IN GENERAL.—In the case of any qualified
10
property or semiconductor manufacturing property
11
placed in service during any taxable year (with the
12
exception of any such property to which subsection
13
(d) applied)), the amount of any credit determined
14
under subsection (a) with respect to such property
15
for such taxable year shall, at the election of the tax-
16
payer, be treated as a payment equal to such
17
amount which is made by the taxpayer against the
18
tax imposed by chapter 1 for such taxable year (re-
19
gardless of whether such tax would have been on
20
such taxpayer).
21
‘‘(2) FORM
AND
EFFECT
OF
ELECTION.—An
22
election under paragraph (1) shall be made prior to
23
the date on which the qualified property or semicon-
24
ductor manufacturing property is placed in service
25
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and in such manner as the Secretary may prescribe.
1
Such election, once made, shall—
2
‘‘(A) be irrevocable with respect to the
3
qualified property or semiconductor manufac-
4
turing property to which such election applies,
5
and
6
‘‘(B) reduce the amount of the credit
7
which would (but for this subsection) be allow-
8
able under this section with respect to such
9
property for the taxable year in which such
10
property is placed in service to zero.
11
‘‘(3) APPLICATION
TO
PARTNERSHIPS
AND
S
12
CORPORATIONS.—In the case of a partnership or S
13
corporation which makes an election under para-
14
graph (1)—
15
‘‘(A) such paragraph shall apply with re-
16
spect to such partnership or corporation with-
17
out regard to the fact that no tax is imposed
18
by chapter 1 on such partnership or corpora-
19
tion, and
20
‘‘(B)(i) in the case of a partnership, each
21
partner’s distributive share of the credit deter-
22
mined under subsection (a) with respect to the
23
qualified property or semiconductor manufac-
24
turing property shall be deemed to be zero, and
25
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‘‘(ii) in the case of a S corporation, each
1
shareholder’s pro rata share of the credit deter-
2
mined under subsection (a) with respect to such
3
property shall be deemed to be zero.’’.
4
(c) CONFORMING AMENDMENTS.—
5
(1) Section 46 of the Internal Revenue Code of
6
1986 is amended—
7
(A) by striking ‘‘and’’ at the end of para-
8
graph (5),
9
(B) by striking the period at the end of
10
paragraph (6) and inserting ‘‘, and’’, and
11
(C) by adding at the end the following new
12
paragraph:
13
‘‘(7) the semiconductor manufacturing invest-
14
ment credit.’’.
15
(2) Section 49(a)(1)(C) of such Code is amend-
16
ed—
17
(A) by striking ‘‘and’’ at the end of clause
18
(iv),
19
(B) by striking the period at the end of
20
clause (v) and inserting a comma, and
21
(C) by adding at the end the following new
22
clauses:
23
‘‘(vi) the basis of any qualified prop-
24
erty (as defined in section 48D(b)(2))
25
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•S 2107 IS
which is part of a semiconductor manufac-
1
turing facility, and
2
‘‘(vii) the basis of any semiconductor
3
manufacturing property.’’.
4
(3) Section 50(a)(2)(E) of such Code is amend-
5
ed by striking ‘‘or 48C(b)(2)’’ and inserting
6
‘‘48C(b)(2), or 48D(d)’’.
7
(4) Section 59A(b)(1)(B)(ii) of such Code is
8
amended—
9
(A) in subclause (I), by striking ‘‘plus’’,
10
(B) by redesignating subclause (II) as sub-
11
clause (III), and
12
(C) by inserting after subclause (I) the fol-
13
lowing:
14
‘‘(II) the credit allowed under
15
section 38 for the taxable year which
16
is properly allocable to the portion of
17
the
investment
credit
determined
18
under section 46 that is properly allo-
19
cable to section 48D(a), plus’’.
20
(5) The table of sections for subpart E of part
21
IV of subchapter A of chapter 1 of such Code is
22
amended by inserting after the item relating to sec-
23
tion 48C the following new item:
24
‘‘48D. Semiconductor manufacturing investment credit.’’.
(d) EFFECTIVE DATE.—
25
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•S 2107 IS
(1) IN GENERAL.—Except as provided under
1
paragraph (2), the amendments made by this section
2
shall apply to property placed in service after De-
3
cember 31, 2021, under rules similar to the rules of
4
section 48(m) of the Internal Revenue Code of 1986
5
(as in effect on the day before the date of the enact-
6
ment of the Revenue Reconciliation Act of 1990).
7
(2) ELECTION
FOR
DIRECT
PAYMENT.—The
8
amendments made by subsection (b) shall be effec-
9
tive with respect to any election made after Decem-
10
ber 31, 2021.
11
Æ
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